Plant operators managing inventory in pie-shaped silo segments can deploy new firmware for the company’s 3DLevelScanner acoustic sensor. The 3DLevelScanner measures and models the topography of material contained in the wedges; the firmware then applies the measured distances to a 3D model of vessel dimensions and converts it to an accurate volume figure.
By contrast, the manufacturer notes, non-contact or guided wave radar devices or weight and cable style sensors measure only a single distance in pie-shaped silo segments. The location of the filling or emptying points or lack of material flow may cause uneven piling of material, leading to inaccurate inventory estimates based upon a single measurement. The 3DLevelScanner maps the material surface, accounting for variations, then factors in the radius and height of the segment being measured—making the volume accuracy very precise, engineers contend. Additionally, buildup on the outer perimeter of the silo or along on the walls can be detected, accounted for in inventory, and addressed by maintenance staff. The same 3DLevel Scanner can be used for either segmented or round silos. — BinMaster, Lincoln, Neb., www.binmaster.com